3D Depth Sensing Products and Solutions
by BECOM Systems
Learn more about Infineon 3D Image Sensors
The combination of Infineon's REAL™ 3D imager family of highly integrated time-of-flight (ToF) sensors and BECOM 's extensive ToF know-how and manufacturing capabilities enable us to deliver top-of-the-line 3D sensing solutions.
- Highly reliable 3D depth point cloud and amplitude picture in every ambient light condition.
- Scalable platform of available sensors to fit your application needs.
- Robust high volume assembly and low calibration efforts.
'It brings time-of-flight to a completely new level.'
Simon Hickman | MultiPix Imaging Components
Simon Hickman | MultiPix Imaging Components
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3D Image Sensors
3D ToF Products
by BECOM
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